Bostik SL C955 Advanced Smoothing Compound

bostik advance videoIntroducing Bostik SL C955 ADVANCED, an innovative high-performance smoothing compound engineered to streamline your flooring projects without the need for extensive subfloor preparation. This two-part compound is designed to save you time and money by eliminating the priming step typically required with other products.

With its outstanding flow characteristics, SL C955 ADVANCED can be effortlessly applied directly onto most common substrates, including old adhesive residues, ceramic tiles, Bostik damp proof membranes, flooring grade plywood, and resin flooring. Its superior adhesion and minimal shrinkage properties ensure a reliable bond and smooth finish every time.

This versatile compound is impervious to moisture, making it suitable for use over damp subfloors before applying a damp proof membrane. Plus, it can be applied in thicknesses ranging from 2mm to 30mm in a single application when mixed with an appropriate aggregate.

With a rapid walk-on time of just two hours and the ability to lay floor coverings in as little as four hours under optimal drying conditions, SL C955 ADVANCED maximizes efficiency without compromising quality. It's specially formulated to integrate seamlessly with waterborne underfloor heating systems and can even encapsulate electric cable-type heating for added convenience.

For flooring projects that demand superior performance and time-saving solutions, trust Bostik SL C955 ADVANCED to deliver exceptional results. Contact our experts today to learn more about how this innovative smoothing compound can elevate your next project.

** Coverage is up to 5m2 based on 3mm height **

Check out this bostik advance video to find out more !